Case Study: Toshiba achieves major module size and thickness reduction with Zuken CR-8000 Design Force

Toshiba achieved significant product size reduction using 3D chip, package, board co-design in CR-8000 Design Force

Toshiba needed to shrink a TransferJet™ module embedded in a customer cell phone from 8 mm x 8 mm to 4.5 mm x 6 mm and reduce module thickness from 1.7 mm to 1.0 mm while adding RF matching, power stabilization and minimizing noise. To meet these tight physical and RF constraints they turned to Zuken’s CR-8000 Design Force (used together with ANSYS analysis tools) for 3D chip/package/board co-design and feasibility studies.

Using Zuken’s CR-8000 Design Force tightly coupled with ANSYS, Toshiba embedded a bare flip‑chip die (face‑down), added test pins, performed native RDL routing and generated hierarchical 3D models for RF, power and noise analysis. Zuken’s solution enabled rapid iteration and fixes: the board and module size and thickness targets were achieved (8×8 mm → 4.5×6 mm; 1.7 mm → 1.0 mm), RF matching was simplified for adoption, power decoupling was optimized, and noise was reduced to about 1/30th of the original measurement.

Toshiba