Case Study: DreamBig achieves 20% engineering productivity gain and accelerated AI accelerator chiplet tapeouts with Synopsys 3DIC Compiler on Synopsys Cloud

DreamBig Boosts Engineering Productivity by 20% to Tapeout AI Accelerator Chiplets with Synopsys 3DIC Compiler on Synopsys Cloud

DreamBig Semiconductor, a San Jose–based startup, builds an open Chiplet Hub platform with industry-leading 3D HBM integration for AI, datacenter, edge and automotive markets. To deliver low cost, low latency, high throughput and plug‑and‑play standards compliance while ensuring first‑pass silicon success, the company needed best‑in‑class multi‑die design and verification, strict PPA targets, cloud‑ready scaling, and simplified CAD/license management.

DreamBig adopted Synopsys’ end‑to‑end EDA and IP stack plus Synopsys Cloud FlexEDA for license orchestration—using 3DIC Compiler for multi‑die architecture, Fusion Compiler for RTL‑to‑GDSII implementation, ZeBu EP for hardware‑assisted verification, and Synopsys Verification IP. The integrated flow enabled early tapeout, industry‑first 3D HBM on logic die, ZeBu setup in 3 weeks (vs. 3 months planned), an estimated 6‑month acceleration in physical architecture convergence, and a 20% boost in engineering productivity through automated license management.

DreamBig

Sohail Syed

Founder and CEO