Case Study: POLYRACK Tech-Group achieves faster development and optimized electronics cooling with SolidWorks Flow Simulation

Optimizing cooling features for electronics packaging with SolidWorks Flow Simulation

Polyrack Tech, a German electronics‑packaging manufacturer of enclosures, 19‑inch subracks and custom systems, faced complex heat‑transfer and cooling challenges for racked electronic systems and a customer request for flow‑simulation consulting. To meet this need without disrupting its CAD workflow, Polyrack Tech adopted SolidWorks Flow Simulation integrated into its SolidWorks CAD environment and added the Electronics Cooling Module to analyze airflow and thermal behavior.

Using SolidWorks Flow Simulation and the Electronics Cooling Module, Polyrack Tech ran CAD‑driven CFD studies to optimize fan layout, add flow‑dispersing perforated plates, reposition PCBs and evaluate multiple heat‑sink configurations. The SolidWorks solution cut a development cycle from three months to two weeks, eliminated about two prototype iterations, generated new flow‑simulation consulting business, and delivered measurable improvements in cooling performance and time‑to‑market.

Polyrack Tech