Case Study: Fraunhofer Institute of Silicon Technology reduces MEMS wafer test time by 6X with National Instruments PXI

Fraunhofer Reduces Test Time by 6X for Wafer-Level MEMs Inertial Sensors

The Fraunhofer Institute of Silicon Technology faced the challenge of reducing test time, system footprint, and cost for the final-stage wafer-level testing of MEMs inertial sensors. To address this, they worked with National Instruments to implement a solution based on the NI PXI platform.

National Instruments provided a solution utilizing a PXI-7854R multifunction RIO module and PXIe-4141 source measure units, all programmed with LabVIEW FPGA. This system allowed for the simultaneous testing of four sensors and onboard signal processing, which reduced the test time per wafer by nearly 6X to under three hours while maintaining measurement accuracy.

Fraunhofer Institute of Silicon Technology

Oliver Schwarzelbach

Fraunhofer Institute of Silicon Technology