Case Study: Leading cloud manufacturing leader INDICS (CASIC) achieves rapid OPC UA integration and open device connectivity with Honeywell Matrikon FLEX OPC UA SDK

Honeywell OPC Supports Open Cloud Solution in China

Leading Cloud Manufacturing Leader operated the INDICS cloud manufacturing platform and needed an open, standards-based way to connect devices from many manufacturers across sites and industries. To rapidly add OPC Unified Architecture (OPC UA) support and ensure broad, secure device connectivity, they turned to Honeywell and its Matrikon FLEX OPC UA SDK.

Honeywell’s Matrikon FLEX SDK abstracted low-level OPC UA details and provided ready-made client functionality, enabling a single developer to build a robust OPC UA interface in just two months—more than halving expected development time—and go live at the end of November 2017. The Honeywell solution delivered secure, scalable connectivity down to sensors and controllers, unlocked integrated monitoring and analytics on INDICS, and was backed by responsive local Matrikon support.