Case Study: Siemens AG achieves better enclosure cooling with Hexagon scSTREAM CFD simulation

Better electronic enclosures by CFD simulation

Siemens AG faced a significant thermal challenge in designing an extremely compact, 12mm thick enclosure for a high-power PCB. The electronics needed to operate continuously in a harsh environment with a strict temperature limit, and an initial design relying on natural convection was projected to fail with temperatures soaring past 250°C.

Using Hexagon’s Cradle CFD software with its scSTREAM solver, the engineering team simulated conjugate heat transfer to analyze the design. Hexagon’s solution enabled the team to innovate a new approach using a thermal interface material and a cavity design, which allowed the enclosure itself to act as an effective heat sink. This application of Hexagon’s technology successfully brought temperatures within the target range, eliminating the need for costly prototype testing and ensuring the final product met all performance requirements.

Siemens AG

Suresh Nidasesi

Project Manager