Case Study: Siemens achieves up to 46% lighter high-performance liquid cold plates with EOS metal additive manufacturing

Siemens cuts chip temperatures by 12% with EOS

Siemens, a leading technology company, faced challenges with conventional electronics cooling solutions, which had limited design freedom, reliability risks from brazed joints, and high energy consumption. They collaborated with vendor EOS GmbH to leverage a Siemens end-to-end digital thread, including software like Simcenter and NX AM, to create a new generation of liquid cold plates.

The solution implemented by EOS GmbH, through their manufacturing partner GKN Additive using EOS metal AM systems, was a topologically optimized, monolithic cold plate design. This resulted in a 12% lower peak chip temperature, a 20% better average cooling performance, and a 46% weight reduction, while also improving reliability and enabling scalable production.

Siemens