Case Study: Advanced Micro Devices (AMD) achieves improved flip-chip reliability and durability with Dassault Systemes' Abaqus FEA (SIMULIA)

Improving reliability of flip-chips with Abaqus FEA from SIMULIA

Advanced Micro Devices (AMD) faced recurring crack formation and delamination in flip‑chip underfill layers caused by mismatched thermal expansion. To predict and prevent these failures, AMD worked with Dassault Systemes and used Abaqus FEA from SIMULIA to study how underfill design variables affect fracture and delamination.

Using Dassault Systemes' Abaqus FEA and Abaqus/CAE, AMD built automated, parametric 3D models and Python‑scripted workflows to simulate temperature cycling and generate crack scenarios for fracture mechanics analysis. The simulations delivered actionable design and material recommendations that optimized the underfill layer, improving flip‑chip reliability and durability across package and board levels and guiding future materials selection and assembly optimization.

Advanced Micro Devices

Zhen Zhang

Senior Packaging Engineer