Case Study: Lam Research Corporation achieves faster, more reliable chip development with Comsol (COMSOL Multiphysics)

The symbiotic relationship between computer chips and computational modeling helps keep Moore’s Law on pace at Lam Research Corporation

Lam Research Corporation, a leading supplier of semiconductor manufacturing equipment, faced tight challenges in controlling nanoscale process variables that affect yield — from keeping CVD gas ring temperatures uniform to understanding wafer bow and predicting buckling in high-aspect‑ratio interconnect structures. To accelerate development and reduce costly trial-and-error testing, Lam’s Computational Modeling and Reliability Group turned to Comsol’s simulation tools, notably COMSOL Multiphysics and its Heat Transfer and Structural Mechanics modules.

Using Comsol, Lam simulated gas‑ring heating/cooling designs to improve temperature uniformity and minimize particle generation, quantified how 1 μm of wafer bow produces about 10 nm of overlay error (at the limit of allowable tolerances), and predicted buckling in temporary high‑aspect‑ratio structures after applying an empirical correlation. These models let Lam optimize tool designs and processing conditions more quickly and accurately, reducing experimental cycles and helping the company maintain performance, reliability, and faster time‑to‑market.

Lam Research Corporation

Peter Woytowitz

Director of Engineering