Case Study: University of Turku achieves efficient LED heat-sink design with COMSOL Multiphysics

Keeping Leds Cool Gets More Manageable Through Simulation

The University of Turku research team, led by Aulis Tuominen and Mika Maaspuro, faced the challenge of designing efficient, cost‑sensitive heat sinks and managing junction temperatures for high‑power LED modules, where physical prototyping is expensive and time consuming. To address this, they used Comsol’s COMSOL Multiphysics simulation software to explore heat‑sink geometries, thermal interface materials (TIMs) and novel high‑conductivity materials before building hardware.

Using Comsol’s COMSOL Multiphysics, the researchers developed and validated electrothermal models — validated against experimental work (e.g., Philips’ tests) — that accurately predicted self‑heating, current crowding, forward voltage and junction temperature. Those validated simulations helped industrial partners such as Hella Lighting and Helvar reduce physical prototyping, accelerate product development, improve thermal design and reliability, and cut development time and costs.

University of Turku

Mika Maaspuro

Researcher