Case Study: Intel achieves faster high-speed interconnect optimization with COMSOL Multiphysics

Intel streamlines interconnect design cycles with Comsol

Intel, a leading technology company, faced the challenge of designing smaller, more densely packed high-speed interconnects for electronic devices that operate at higher frequencies. To reduce the number of costly prototypes needed for testing new designs, they sought a more efficient computational method and turned to vendor Comsol for a solution using COMSOL Multiphysics® software.

The solution implemented by Comsol involved combining full-wave electromagnetic simulation from their COMSOL Multiphysics® product with a custom space-mapping algorithm. This approach allowed Intel to quickly optimize interconnect designs, which significantly streamlined their design cycle and reduced time to market for their latest high-speed interconnect technology.

Intel