Case Study: Besi achieves less die deformation in memory chip manufacturing with COMSOL Multiphysics

Besi reduces die deformation with Comsol multiphysics simulation

The customer Besi, a developer of equipment and assembly processes for semiconductor packaging, faced the challenge of ensuring memory chips remained intact during manufacturing as they became smaller. Their specific issue was preventing die deformation during the process of peeling tape from a chip. To address this, Besi utilized multiphysics simulation from the vendor Comsol.

Comsol's multiphysics simulation software was used to explore and optimize a new tape-peeling method. This solution resulted in significantly less deformation of the dies during manufacturing. The optimized process developed with Comsol's tools is now implemented by semiconductor packaging factories worldwide.

Besi