Case Study: BE CAE & Test achieves interactive thermal analysis for surface-mount devices with COMSOL

BE CAE & Test builds a thermal analysis app with Comsol for 3 key SMD variables

BE CAE & Test, a COMSOL Certified Consultant, required a way to deliver an interactive thermal analysis tool to their clients for investigating surface-mount devices. They utilized the Application Builder in COMSOL Multiphysics® to address this challenge.

Comsol's solution involved building a custom simulation app from a thermal model. This app allows end users to interactively vary materials, solder thickness, and thermal power to analyze impacts on temperature and thermal resistance. The result was a highly effective deliverable that pleased clients, providing them with a powerful tool to investigate their own systems.

BE CAE & Test