Case Study: Ebullient achieves optimized, high‑temperature waterless cooling modules and rapid, cost‑effective production with Carbon

Ebullient changes the game with revolutionary “waterless” liquid cooling technology

Ebullient, a Madison, Wisconsin–based developer of two-phase direct-to-chip “waterless” cooling modules, needed to overcome the severe design limitations imposed by injection molding. Their sealed modules use a non-conductive engineered fluid that partially vaporizes to remove heat from CPUs and GPUs, but injection-mold constraints (draft angles, undercuts, simplified geometries) prevented them from manufacturing the CAD‑ and analysis‑optimized designs. Ebullient partnered with Carbon, using Carbon’s CLIP 3D printing technology and its CE 221 cyanate ester–based resin to address these challenges.

Carbon’s CLIP process let Ebullient produce modules exactly as engineered, enabling contoured, graduated inlets for even fluid flow and eliminating costly, single‑use molds (a single injection mold can cost tens of thousands of dollars). The CE 221 material provides a glass transition temperature of at least 175 °C and long‑term thermal and mechanical stability (withstanding several hundred pounds of pressure and operating temperatures up to ~100 °C), while CLIP reduced tooling expense and shortened time to market so Ebullient can more quickly and cost‑effectively deliver new modules for Intel, NVIDIA, AMD, IBM and other platforms. Carbon’s solution restored the digital thread from design to manufacture and improved module performance and producibility.

Ebullient

Brett Lindeman

Director of Advanced Development