Case Study: CreditVidya expands affordable loan access to millions with AWS Glue

CreditVidya Extends the Loan Market to Millions of Financially Excluded Indians with AWS

CreditVidya is an India‑based fintech startup whose Medhas platform uses AI/ML to score credit for more than 250 million financially excluded people who lack collateral or credit histories and for whom traditional loan processing has been too costly and slow. To address scale, security, and data integration challenges, CreditVidya runs Medhas on AWS and has begun using AWS Glue to build data lakes that aggregate applicants’ digital footprints for more accurate underwriting.

Using AWS Glue as part of its broader AWS deployment (Amazon EC2, EMR, S3, DynamoDB, GuardDuty, etc.), CreditVidya scaled ingestion from 10,000 to 100,000 daily applications, built 250–500 TB data lakes, and processed more than 25 million applications. The AWS‑based solution cut per‑loan processing costs from about $2 to under $0.01, raised partner loan approval rates by 25%, reduced delinquency by 33%, supports 10× more daily applications, and has driven roughly 55% year‑on‑year business growth. AWS Glue enabled faster data preparation and analysis that helped CreditVidya extend lower‑rate institutional credit to millions.

CreditVidya

Srikanth Gaddam

Vice President of Information Technology & Security