Case Study: Nefelus achieves up to 99% faster, secure large-file cloud transfers with Aspera

Enabling Innovation in Electronic Chip Design

Nefelus provides a cloud-based service for Electronic Chip Design, giving IC designers access to scalable computing and third-party EDA tools. To make the platform practical for real projects, Nefelus needed a fast, reliable transfer mechanism to move large design files (from megabytes to gigabytes) to and from the cloud while protecting sensitive intellectual property.

Nefelus selected Aspera Application Platform On Demand and used the SDK to integrate Aspera’s FASP™ technology directly into its web portal, with end users uploading via the Aspera Connect Web Browser Plug-in and accessing design tools and compute resources in the cloud. The result: transfer times cut by up to 99 percent, enterprise-grade protection of users’ IP throughout transfers, and faster global collaboration and project turn-around.

Nefelus

Dimitris Fotakis

CEO & Founder, Nefelus