Case Study: Samsung Electronics achieves faster, more accurate package thermal analysis and reduced testing time with ANSYS

Using Simulation at the Conceptual Design Stage

Samsung Electronics’ IPT group, which handles thermal design and analysis for semiconductor packages (microprocessors, display drive ICs, smart cards and panel processors), needed to model detailed package features (traces, vias, bondwires, solder balls), handle diverse and complex SIP/POP structures, account for thermally induced effects on high‑performance devices, and make simulation accessible to non‑thermal engineers. To meet these challenges the company adopted ANSYS software for package thermal analysis.

ANSYS provided an ECAD-importing, adaptive-meshing solver and a one‑step modeling-to-reporting workflow that creates compact, accurate models with fast solve times, enabling engineers to run simulations from the conceptual stage. As a result, Samsung Electronics significantly increased thermal-analysis efficiency, improved prediction accuracy during design verification, and considerably reduced measurement time and expense.

Samsung Electronics

Jaewook Yoo

Samsung Electronics