ANSYS
166 Case Studies
A ANSYS Case Study
Qorvo, a leading RF solutions and semiconductor company, was struggling with long runtimes and frequent failures when simulating complex laminate designs and process-corner variants across users of varying skill levels. To address memory- and compute-intensive meshing/adaptive and frequency-sweep phases, Qorvo deployed ANSYS software—notably ANSYS HFSS with ANSYS Electronics HPC, Distributed Solve (DSO) and ANSYS Optimetrics—to support its EM simulation workflows.
ANSYS’ solution (running on an SGI UV 2000 HPC system) enabled larger in-memory simulations, more parallel processes, and simultaneous execution of design variations, removing the need for users to pre-specify memory. As a result, ANSYS-powered workflows cut large-memory simulation times by up to ~50% (from 8–12 hours to about 4 hours), reduced process‑corner runtimes by up to ~85% (from ~20 hours to ~3 hours), and eliminated memory-related simulation failures while simplifying job scheduling.