Case Study: ABB achieves optimized power-electronics thermal management with ANSYS Icepak

ABB - Customer Case Study

ABB Switzerland Ltd., a global leader in power and automation technology, needed to predict and control heat in its HiPak™ power-electronics modules to ensure reliability across diverse cooling systems and applications. To address this challenge ABB used ANSYS Icepak software to model maximum package temperatures and the thermal behavior of IGBTs, diodes and heat exchangers.

ANSYS’s Icepak provided full temperature-field predictions for the coupled module–heat-exchanger system, enabled rapid optimization of heat-exchanger configurations, and supported parametric studies to evaluate material or component changes. The solution delivered accurate per‑component temperature predictions, faster design iterations and improved thermal management—helping ABB increase reliable power draw and overall product reliability while shortening thermal-design cycle time.

ABB

Matteo Fabbri

Scientist, Corporate Research