Case Study: Wilting achieves higher performance, productivity, and reliability in semiconductor capital equipment with 3D Systems' metal additive manufacturing

Increasing Performance, Productivity, and Reliability in Semiconductor Capital Equipment

Wilting, a precision machining partner to semiconductor OEMs, teamed with 3D Systems to accelerate adoption of metal additive manufacturing for semiconductor capital equipment. The challenge was to improve imaging accuracy, throughput, and reliability while replacing heavy, multi-piece parts that induce vibration and limit scaling from prototyping to production as chip geometries continue to shrink.

Using 3D Systems’ application engineering, production support, DMP Flex 350 metal AM, and hands-on technology transfer, Wilting began producing optimized monolithic components (manifolds, wafer tables, flexures) ready for cleanroom use. The results include up to 50% weight reduction, a 90% drop in flow-induced disturbance forces (delivering 1–2 nm accuracy gains), greater throughput and reliability, fewer assembly steps, lower TCO, and scalable capacity with overflow production support.

Wilting

Adwin Kannekens

Sales Director